JTEKT Toyoda Americas
The interior of the DXSG320 wafer grinder showing two wafers in position for grinding.
The interior of the DXSG320 wafer grinder showing two wafers in position for grinding.
The interior of the DXSG320 wafer grinder showing two wafers in position for grinding.
The interior of the DXSG320 wafer grinder showing two wafers in position for grinding.
The interior of the DXSG320 wafer grinder showing two wafers in position for grinding.

New, High-Productivity Silicon Wafer Disc Grinder

Dec. 1, 2022
Automated, dual-side grinding improves accuracy and productivity over single-spindle vertical grinders.

JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a notable improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today, which grind to 3-4 microns, according to JTEKT.

Previously, JTEKT offered a single-spindle wafer grinding machine.

A further advantage is that the new DXSG320 grinder footprint is approximately 20% smaller than other machines and incorporates fully automated work handling internal to the machine. Wafers are put into a fixture and loaded into a rack system that carries wafers into the machine for sizing and finishing to customer specifications.

To ensure correct stock removal and optimal quality, wafer thickness is measured before and after grinding. During grinding, discs float in the fixtures and spin during the grinding process. The result is quick and even material removal. Because there is no need to flip over the part during the grinding process, operators will save considerable cycle time.

A JTEKT spokesman explained that the machine’s single wafer grinding method simplifies automation and traceability: “A key advantage this machine offers over the vertical spindle design is equal stock removal on both sides of the disc in one operation. This not only reduces the need for multiple machines to achieve desired production levels, but users also are assured of consistently removing the same amount of stock on both sides – as compared to vertical machines that grind only one side at a time.”

Other important features of the grinder are a GW high-frequency spindle with air static pressure and a built-in motor to achieve high speed, high accuracy grinding. In-process, wheel positioning is automatic through high accuracy air gauging. The use of pure water instead of coolant is environmentally friendly.

The machine is compatible with a variety of data collection systems through easy-to-use communication software.

Learn more at www.jtektmachinery.com

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