The molecular-decomposition-process (MDP) grinder removes metal with a combination of electric current, special electrolytes, and abrasives. The electric current flows through the electrolyte between the positively charged workpiece and negatively charged abrasive wheel. The electrochemical oxidation that occurs produces a soft hydroxide film on the workpiece surface. This soft-alloy surface is then "wiped away" by the wheel's abrasives, exposing more surface material for repeating the process.

A molecular-process control, a PLC-based system that uses fuzzy logic and neural network technology for closed-loop monitoring, handles grinder operations. According to the manufacturer, the machine precisely grinds any conductive metal to within 0.0002 in. but is gentle enough to cut thin-walled parts without damage or distortion.

Chevalier Machinery
Santa Fe Springs, Calif.
chevalierusa.com