The CITCO Diamond and CBN Operations of Cinetic Landis Grinding Corp. (www.citcodiamond.com) has introduced the Dipax D4 polycrystalline diamond cutting tool material, and recommends it for milling and rough cutting aluminum alloys in which a high chip resistance is required. The material also can be used to machine medium-high silicone-aluminum alloys where tools need to display high abrasion resistance. The company says the D4 material is exceptionally fine-grained and can be processed more easily with EDM and mechanical grinding than other PCD grades.